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领建电子(香港)有限公司
 


手机 WiFi 模块
WiFi WL1251 Module for Cell Phone
( 型号 : LK-65598 )
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WiFi WL1251 Module for Cell Phone

WiLink?4.0 mWLAN Solutions (WL1251/WL1253) - Availability Disclaimer

Texas Instruments (TI's) WiLink?mobile Wireless LAN (mWLAN) platform includes single-chip solutions to drive Voice over WLAN (VoWLAN) into mainstream mobile phones. Based on TI's DRP?technology, the WiLink 4.0 mWLAN platform is comprised of hardware and software optimized for handsets, and provides consumers with on-the-go voice access over any WLAN network.

The included WiLink Software Development Kit (SDK) 4.X is optimized for embedded applications. This includes support for Linux®, Windows® WinCE? Symbian?operating systems, as well as lab testing and manufacturing software. It is partitioned to minimize host CPU loading and power consumption in mobile applications.

TI's WiLink 4.0 mWLAN platform offers two different hardware single-chip implementations to provide flexibility for OEMs to offer IEEE 802.11b/g or IEEE 802.11a/b/g operation.

WiLink 4.0 mWLAN Platform Solutions

Solution Supported Standards

WL1251 802.11 b / g

802.11 e / i / d / k

WL1253 802.11 a / b / g

802.11 e / i / d / k / h / j

Get Started Now: Download the following documents for more information:

WiLink 4.0 mWLAN Product Bulletin (WL1251/WL1253) (wl1251_1253_prod_bulletin.pdf, 140 KB)

2005 Download

WiLink 4.0 mWLAN (WL1251 and WL1253) Single-Chip Solutions

Complete WLAN hardware and software solutions optimized for mobile IEEE 802.11b/g and IEEE 802.11a/b/g applications

The integrated Media Access Controller/Baseband/RF transceiver) reduces BOM costs, saves PCB space and extends standby and talk times

Market-leading physical size (6 mm x 6 mm BGA)

Support for Voice over WLAN (VoWLAN)

UMA (Unlicensed Mobile Access) technology

VoIP over WLAN

Quality of service, WPA, WPA2, CCX2.0, 3.0 and 4.0 for application specific devices

Advanced roaming support enabling rapid migration between access points and between WLAN and cellular subsystems

Industry's lowest power consumption with TI's Enhanced Low Power (ELP? technology

Bluetooth® coexistence technology ensures high quality of service during simultaneous voice and data WLAN and Bluetooth operations



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[ 联系方式 ]
icon 公司名称 领建电子(香港)有限公司
icon 街道地址 广东 深圳 南山
icon 电话号码 86 - 0755 - 26501512
icon 传真号码 86 - 0755 - 26501512
icon 公司网址 www.linkinghk.cn
icon 联系人 喻'R /

 
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